· Semiconductor & Electronics · Source: reuters.com

Samsung ships latest HBM4 chips to catch-up in AI race

Samsung Electronics has begun shipping its latest HBM4 high-bandwidth memory chips to customers, aiming to close the gap with rivals SK Hynix and Micron in the AI accelerator market. The HBM4 chips offer speeds up to 13Gbps, a 22% improvement over HBM3E, helping tackle data bottlenecks for AI and HPC applications. Samsung also plans next-generation HBM4E samples later in 2026 to strengthen its competitive position.

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