Paras Semiconductors, BroadPak join hands to build advanced semiconductor packaging capabilities
Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has entered a strategic technology partnership with US-based BroadPak Corporation to build advanced semiconductor packaging capabilities in India. It will gain BroadPak’s intellectual property, technology transfer and process know-how in 2.5D/3D packaging and chiplet integration, supporting a planned heterogeneous integration and 3D packaging OSAT facility, anchored by a Rs 6,200 crore project in Madhya Pradesh.