· Semiconductor & Electronics · Source: economictimes.indiatimes.com

Odisha gets 3D chip packaging unit

Odisha has strengthened its position in India’s semiconductor ecosystem with the launch of the country’s first 3D glass substrate chip packaging facility. The ₹1,943 crore project by 3D Glass Solutions Inc. marks a major step in advanced electronics manufacturing. The unit will support high-end chip packaging technologies, boosting domestic capabilities in semiconductors and positioning Odisha as an emerging hub for next-generation electronics and chip innovation.

Read source

Evaluating a similar location, plant, or policy window?

Bucephalus advises on greenfield industrial projects in South India.

Talk to Bucephalus

This page is a curated briefing. The original article belongs to economictimes.indiatimes.com. Bucephalus does not republish the source in full.