First India-made chip module sent to US firm AOS

India’s first commercially packaged multi-chip module (MCM) has been rolled out by Kaynes Semicon’s Sanand OSAT facility and shipped to California-based Alpha & Omega Semiconductor (AOS). The complex intelligent power modules (IPMs) integrate multiple power and control components, supporting applications from EVs to renewable energy. The move marks a significant milestone under India Semiconductor Mission 1.0.
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